[Summer 2024] Module Process Engineer Intern, Arizona

[Summer 2024] Module Process Engineer Intern

At TSMC Arizona, brilliance can ignite a world of innovation and launch a promising future. The world’s most brilliant innovators entrust us to transform their ideas into world-changing products that impact millions of lives. As long as you have the same passion to pursue excellence, you will find your fit here.

TSMC Arizona module engineering departments are looking for process engineering talents to join our 5-nanometer fab, located in sunny Phoenix, Arizona. As a Process Engineer, you will focus on delivering a robust and efficient semiconductor manufacturing process with data driven analytics and systematic problem-solving skills.

• CMP   : Chemical Mechanical Planarization
• CVD   : Chemical Vapor Deposition
• PVD   : Physical Vapor Deposition
• EPI     : Epitaxy
• DIF     : Diffusion
• WET   : Wet Clean
• ME     : Metrology
• Etch   : Wet Etch and Dry Etch
• LIT     : Lithography

Job Description:

Your main responsibilities include, but are not limited to:

• Designing and executing experiments, interpreting, and extracting insightful results from complex data sets to optimize the manufacturing process and achieve precision control at atomic levels.
• Applying statistical process control methods to establish and sustain a robust manufacturing process.
• Qualifying and sustaining manufacturing process to expand capacity with speed and quality.
• Collaborating effectively with equipment and material suppliers and partners to identify technology gaps and deficiencies; devise, evaluate and qualify mitigation and continuous improvement solutions.
• Driving continuous improvements on process stability and capability, quality, reliability, yield, productivity, and safety.
• Scheduled night shifts and weekend on-call rotations in a 24/7 high-volume manufacturing environment.

Minimum Qualifications:

Applicants must be legally eligible to work in the United States and have:

• Bachelor, Master or Ph.D. in Electrical Engineering, Chemical Engineering, Mechanical Engineering, Materials Science, Physics, or related fields.
• Academic skills of numerical analysis, statistics, optics, chemistry, or physics.
• Knowledge of semiconductor manufacturing process and design would be a strong add.
• Flexibility to change priorities and responsibilities to support business needs
• Willing to work in a clean room environment.
• Polished presentation and interpersonal skills.

Personal Attributes:

• Good communication and interpersonal skills that enable you to work on cross-functional and geographically dispersed teams.
• Must be able to work full time (40 hours per week) on-site at our Phoenix location from May 20th 2024 – August 2nd 2024
• Able to adapt priorities and responsibilities to support business needs.
• Hands-on participant with a strong sense of ownership
• An excellent team player with leadership skills that can multitask and thrive in a very dynamic and fast-paced environment.
• Goal driven with demonstrated ability of working in a high performing team culture.
• Quick assimilation to new technology.
• Ability to troubleshoot complex problems and to own the efforts to address and resolve root causes.

Work Location: Phoenix, AZ

Travel: None